NEC member IBM recently announced that it would be developing a new mobile phone chip in Essex Junction, Vermont.
This new chip will be 30 percent smaller and faster then its predecessor and will enable smartphones to drop fewer calls, have a longer battery lives, and download at faster speeds. The 7SW SOL chip will also bring smartphones closer to being “world phones” with the chips increased use of frequency bands. This month, design kits will be made available to developers who will create products to work with the new chip.
Christine Dunbar, Director of Specialty Foundry Business Unit at IBM, said, “It’s very exciting. There’s lots of demand for this product right now.”
The New England Council applauds IBM for their commitment to developing microchip technology in Vermont.